82 lines
1.9 KiB
Plaintext
82 lines
1.9 KiB
Plaintext
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DF8OEs investigations about sensor access
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Temperature and humidity sensor directly goes to STM. There is no interface
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chip to handle them - all is done by software.
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Pinout of sensor boom:
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----------------------
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1 - GND
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2 - temperature sensor (1)
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3 - GND
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4 - humidity sensor1 (1)
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5 - GND
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6 - humidity sensor1 (2)
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7 - GND
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8 - heater humidity sensor
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9 - heater humidity sensor
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10 - GND
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11 - humidity sensor2 (1)
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12 - GND
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13 - temperature sensor (2) and humidity sensor2 (2)
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14 - GND
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15 - GND
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16 - GND
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17 - GND
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18 - GND
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19 - GND
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20 - GND
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Counted from left to right if you position flexsensor in front of you, pins near
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to you, sensor away from you, copper upside
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All connections leading to sensor boom do have corresponding test points on PCB:
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--------------------------------------------------------------------------------
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Position PCB in front of you, flatconnector upside, sensor boom showing away from
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you, TX antenna leading to you. I draw connector as a row of "+++". Testpoints are
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small round copper isles (numbers correspond to sensor boom, G == GND, ? == unknown):
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11
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+++++++++++++++++++++++
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G 4
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8 6 2
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13 ? 9
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Investigations about temperature sensor:
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----------------------------------------
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Temperature sensor is resistance-based. If you insert a resistor between
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pin2 and pin13 of flatconnector, the following telemetry is transmitted:
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330R --> -168°
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560R --> -113°
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820R --> -52°
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1K --> -4.1°
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1.5K --> 121°
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2.2K --> 319°
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Pressure sensor module:
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-----------------------
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This module is connected to SPI2 of STM. It uses SPI_NSS and only data output
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from module - SPI output from STM is not connected to module. So I think it is
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a kind of polling.
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2 be continued
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